MOSFET with a second poly and an inter-poly dielectric layer over gate for synchronous rectification

ABSTRACT

This invention discloses a new trenched vertical semiconductor power device that includes a capacitor formed between a conductive layer covering over an inter-dielectric layer disposed on top of a trenched gate. In a specific embodiment, the trenched vertical semiconductor power device may be a trenched metal oxide semiconductor field effect transistor (MOSFET) power device. The trenched gate is a trenched polysilicon gate and the conductive layer is a second polysilicon layer covering an inter-poly dielectric layer disposed on top of the trenched polysilicon gate. The conductive layer is further connected to a source of the vertical power device.

This is a Continuous-In-Part (CIP) Application of a previously filedco-pending application with Ser. No. 11/083,470 filed on Mar. 18, 2005by identical common inventors of this application. Applications Ser. No.11/083,470 is hereby incorporated by reference in this patentapplication.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention disclosed herein relates generally to the deviceconfiguration of power MOSFETs. More particularly, this inventionrelates to a novel and improved device structure for preventing shootthrough problem by using a capacitor formed on top of the gate as asecond poly with an inter-poly dielectric layer.

2. Description of the Prior Art

Conventional power MOSFET devices still face the shoot through problemsthat result in excessive dissipation and efficiency loss. Referring toFIG. 1 for a circuit diagram of a conventional buck converter 10 thatincludes a high side MOSFET 15 and a low side MOSFET 20 seriallyconnected between an input terminal 25 having an input voltagerepresented by V_(in) and a ground terminal 30. The drain of the lowside MOSFET 20 is connected to the source of the high side MOSFET 15 ata mid point 35 connecting to the load 40 through inductance L andcapacitance C. When the buck converter 10 operates at high speed, ashoot through condition becomes a problem when both the high side andlow side MOSFET are turned on at the same time causing a shoot throughcurrent to flow between the input terminal 25 and the ground terminal30. The shoot through condition results in excessive dissipation andefficiency loss. In order to avoid the shoot through problem, acontrolling circuit 45 is implemented to control the gate signals togenerate a dead time between the gate signals for the high side and lowside MOSFET. FIG. 2 shows such a dead time between the time when thehigh side MOSFET 15 is turned off and the time when the low side MOSFET20 is turned on such that the high side and low side MOSFETs areprevented from turning on simultaneously.

However, the shoot through problem cannot be completely avoided due tothe fact that a large drain current is generated at the low side MOSFET20 when the high side MOSFET 15 is turned on as shown in FIG. 3 due to alarge rate of change of the voltage, i.e., dV/dt, at the mid-connectionpoint 35. FIG. 4 shows an equivalent circuit of the buck converterwherein the drain current generated flows through the gate-draincapacitor Cgd and then to the ground through the internal gate-sourcecapacitor Cgs or through an equivalent circuit segment comprises gateresistor Rg inductor Lg, and external gate drive resistance Rext. Undersuch circumstances, if the impedance from the gate to the ground is notbelow a certain value then the drain current, i.e., Cdg*dV/dt, willgenerate a voltage drop across the gate of the low side MOSFET thatwould be large enough to turn on the low side MOSFET 20 thus inducingshoot-through. The peak of the spike voltage can be expressed as:Vspike=Vin*Crss/(Crss+Ciss)Where the input capacitance Ciss and feedback capacitance Crss aredetermined by the following equations:Ciss=Cgd+CgsCrss=CgdIn modern circuit designs, a designer typically controls the problem byusing a large gate-source capacitance Cgs or a low Crss/Ciss ratio.Increasing Cgs results in Crss/Ciss reduction. As it is shown in FIG. 4,a large Cgs has the benefit of drawing most of the transient draincurrent Cdg*dV/dt to the ground through the capacitor, leaving lesscurrent to go through the external gate controller thus lowering thegate spike voltage and avoiding shoot through. Alternately, the problemmay also be prevented by providing a low gate resistance and using ahigh current gate drive with low Rext. However, if the gate drivecircuitry, i.e., the control circuit 45, is remote from the MOSFET, theinductance Lg may become quite large. This causes the current pathconnected with Rg, Rext, and Lg to have great impedance thus leavingonly the Cgs path to sink the transient current. The only way tosuppress the shoot through current is by increasing the capacitance Cgsto reduce the impedance. However, this solution will lead to excessivegate charge losses in the low side MOSFET 20. For the above reasons, aperson of ordinary skill of the art is faced with limitations anddifficulties in designing a converter to effectively prevent the shootthrough problem.

FIG. 5A shows a typical conventional trench MOSFET. As illustrated inthis trench MOSFET cell, input capacitance Ciss includes the source togate capacitance Cgs and the body to gate capacitance and Crss is thegate to drain capacitance. The ratio Crss/Ciss can be reduced either byincreasing Ciss or reduce Crss. As shown in FIG. 5B, Crss is determinedby the vertical area capacitance of the trench beyond the body regionshown as C1, and C2 and further determined by another horizontal areacapacitance shown as C3. Reducing the area capacitance C1, C2, or C3 canreduce the capacitance Crss. However, due to the process control, yieldrequirements and minimum linewidth limitations in the fabrication thetrenched MOSFET, it is difficult to reduce the capacitances C1, C2, orC3. FIG. 6 shows a MOSFET with increased source depth to increase Ciss.This technique is difficult to implement for several reasons. First ofall, the source junction depth may have to be significantly increased inorder to increase the Ciss for reducing the Crss/Ciss ratio. However, inorder to maintain the same channel length, the body junction depth mustalso be increased. The configuration as shown in FIG. 6 is not practicaluseful due to the limitations that it is difficult to manufacture areliable trenched MOSFET device with short channel when implemented witha deep source and deep body junction.

Therefore, a need still exists in the art to provide an improved deviceconfiguration and manufacturing methods to make MOSFET devices with areduced Crss/Ciss ratio to prevent the occurrences of shoot-through andresolve the above discussed difficulties as now encountered in the priorart.

SUMMARY OF THE PRESENT INVENTION

It is therefore an object of the present invention to provide animproved MOSFET device by reducing Crss/Ciss ratio with an increase ofthe gate-source capacitance Cgs to prevent the occurrences ofshoot-through. The shoot through problem is resolved because an increasecurrent is drawn to the ground thus preventing a spike voltage to turnon the gate. The technical difficulties and limitations are thereforeresolved.

Specifically, it is an object of the present invention to provide animproved MOSFET device with a reduced Crss/Ciss by providing a capacitorover the trenched gate thus increasing the gate-source capacitance. Thecapacitor over the gate is formed with a new device configuration thathas a second poly covers an inter-poly dielectric layer deposited overthe trenched gate. The MOSFET further has a novel trenched gate whereinthe trenched gate has a protrusion that protrudes out of the trenchfurther reduces the Crss/Ciss. The increased Cgs and the reducedCrss/Ciss thus achieving the purpose of suppressing the shoot throughand resolve the difficulties discussed above. Unlike the conventionaltechniques as shown in FIGS. 5 and 6, the reduction of the Crss/Ciss isachieved without requiring complicate fabrication processes and controlof the recess electrode.

Briefly in a preferred embodiment this invention discloses a newtrenched vertical semiconductor power device that includes a capacitorformed between a conductive layer covering over an inter-dielectriclayer disposed on top of a trenched gate. In a preferred embodiment, thetrenched vertical semiconductor further includes a trenched metal oxidesemiconductor field effect transistor (MOSFET) power device. In apreferred embodiment, the trenched gate further includes a trenchedpolysilicon gate. In a preferred embodiment, the conductive layerfurther includes a second polysilicon layer covering an inter-polydielectric layer disposed on top of a trenched polysilicon gate. In apreferred embodiment, the conductive layer is further connected to asource of the vertical power device. In a preferred embodiment, thetrenched vertical semiconductor further includes a protectivepassivation layer covering the vertical semiconductor power devicehaving metal contact openings to form metal contacts therein toelectrically contact the trenched vertical semiconductor device. In apreferred embodiment, the inter-dielectric layer disposed above thetrenched gate having a layer thickness ranging substantially the same asa gate dielectric thickness. In a preferred embodiment, the trenchedgate further includes a gate protrusion protruding outside of thetrenched gate. In a preferred embodiment, the trenched verticalsemiconductor further includes a trenched N-channel metal oxidesemiconductor field effect transistor (MOSFET) power device. In apreferred embodiment, the trenched vertical semiconductor furtherincludes a trenched P-channel metal oxide semiconductor field effecttransistor (MOSFET) power device.

This invention further discloses a method for fabricating a trenchedvertical semiconductor power device by forming a capacitor between aconductive layer covering over an inter-dielectric layer disposed on topof a trenched gate. In a preferred embodiment, the method furtherincludes a step of forming the trenched gate as a trenched polysilicongate. In a preferred embodiment, the step of covering the conductivelayer over the inter-dielectric layer further includes a step of forminga second polysilicon layer covering an inter-poly dielectric layerdisposed on top of a trenched polysilicon gate. In another preferredembodiment, the method further includes a step of electricallyconnecting the conductive layer to a source of the verticalsemiconductor power device. In another preferred embodiment, the methodfurther includes a step of forming a protective passivation layercovering the vertical semiconductor power device and selectively etchingmetal contact openings to form metal contacts therein to electricallycontact the trenched vertical semiconductor device. In another preferredembodiment, the step of forming the inter-dielectric layer disposedabove the trenched gate further comprising a step of forming theinter-dielectric layer with a layer thickness substantially the same asa gate dielectric thickness. In another preferred embodiment, the methodfurther includes a step of forming the trenched gate with a gateprotrusion protruding outside of the trenched gate. In another preferredembodiment, the method further includes a step of forming the verticalsemiconductor device as a trenched N-channel metal oxide semiconductorfield effect transistor (MOSFET) power device. In another preferredembodiment, the method further includes a step of forming the verticalsemiconductor device as a trenched P-channel metal oxide semiconductorfield effect transistor (MOSFET) power device.

This invention further discloses a method for adjusting a gate-sourcecapacitance (Cgs) of a trenched MOSFET device. The method includes astep of disposing a capacitor on top of a trenched gate by forming aconductive layer covering over an inter-dielectric layer deposited ontop of the trenched gate of the MOSFET device. In another preferredembodiment, the method further includes a step of forming the trenchedgate as a trenched polysilicon gate. In another preferred embodiment,the step of covering the conductive layer over the inter-dielectriclayer further includes a step of forming a second polysilicon layercovering an inter-poly dielectric layer disposed on top of the trenchedpolysilicon gate. In another preferred embodiment, the method furtherincludes a step of forming the trenched gate with a gate protrusionprotruding outside of the trenched gate.

These and other objects and advantages of the present invention will nodoubt become obvious to those of ordinary skill in the art after havingread the following detailed description of the preferred embodiment,which is illustrated in the various drawing figures.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a circuit diagram of a conventional buck converter.

FIG. 2 shows the waveforms of gate voltages for the high side and lowside MOSFET of FIG. 1.

FIG. 3 shows the gate spike and drain to source voltage Vds of the lowside MOSFET resulting from a high rate of change of the drain (Vds)voltage of high side MOSFET.

FIG. 4 shows a conventional circuit in attempt to resolve the shootthrough problem as that shown in FIG. 3.

FIG. 5A shows a typical conventional trench MOSFET.

FIG. 5B is a diagram showing the components of Ciss and Crss.

FIG. 6 shows a MOSFET with increased source depth to increase Ciss.

FIG. 7 is a side cross sectional view of a MOSFET device of thisinvention.

FIGS. 8A and 8B are the dependence of Crss/Ciss ratio over oxidethickness and gate protrusion respectively.

FIGS. 9A to 9T are a serial of side cross sectional views forillustrating the processing steps for manufacturing the MOSFET device ofFIG. 7.

DETAILED DESCRIPTION OF THE METHOD

Referring to FIG. 7 for a side cross sectional view of a new MOSFET cell100 of this invention. The MOSFET 100 is formed on an N⁺ substrate 105functioning as a drain. The N+ substrate supporting a N− epi-layer 110thereon to form a vertical pnjunction region with an N⁺ source region115 formed on top of a deeper p-body region 120. The MOSFET 100 furtherincludes a gate 125 formed with polysilicon layer deposited in a trenchformed in the epi-layer 110 with a gate oxide layer 130 insulating thegate 125 inside the trench. A current path is established from thesource 115 via a channel formed in the p-body 120 along the gate 125 andextends to the drain in the N⁺ substrate 105 when gate 125 is properlybiased. In this new MOSFET cell 100, an additional polysilicon layer 135electrically connected to the source 115 is formed on top of aninter-poly dielectric layer 140 overlying the polysilicon in thetrenched gate 125. An insulation layer 145 formed with BPSG covering theMOSFET cell with metal contact opening for contact metal layer 150electrically connected to the source 115 and body regions 120.

Additional capacitor is formed between the second polysilicon layer 135and the gate 125. The input capacitance Ciss is increased with thisadditional capacitor thus improves the Crss/Ciss ratio. The capacitanceof the added capacitor between the first and second poly can be adjustedby changing the thickness of the inter-polysilicon dielectric layer 140.FIG. 8A shows the dependence of Crss/Ciss ratio over the thickness ofinter-poly layer t. The capacitance may also be adjusted by changing theprotrusion of the polysilicon gate outside of the trench. FIG. 8B showsa functional relationship of Crss/Ciss ratio that changes versus thegate protrusion h. Therefore, the Crss/Ciss ratio can be flexiblyadjusted independent from the other device performance parameters.

As explained above, the input capacitance Ciss and feedback capacitanceCrss of the MOSFET device are determinate by the functional relationshipthat Ciss=Cgd+Cgs and Crss=Cgd. Therefore, the ratio Crss/Ciss reducesas Cgs is increased because that causes increased value of Ciss.According to what is shown in FIG. 4, a large Cgs has the benefit ofdrawing most of the transient drain current Cdg*dV/dt to the groundthrough the capacitor, leaving less current to go through the externalgate controller thus lowering the gate spike voltage and avoiding theoccurrences of a shoot through.

According to above descriptions, this invention discloses a trenchedvertical semiconductor power device that includes a capacitor formedbetween a conductive layer covering over an inter-dielectric layerdisposed on top of a trenched gate. In a preferred embodiment, thetrenched vertical semiconductor power device further includes a trenchedmetal oxide semiconductor field effect transistor (MOSFET) power device.In a preferred embodiment, the trenched gate further comprises atrenched polysilicon gate. In a preferred embodiment, the conductivelayer further comprises a second polysilicon layer covering aninter-poly dielectric layer disposed on top of a trenched polysilicongate. In a preferred embodiment, the conductive layer is furtherconnected to a source of the vertical power device. In a preferredembodiment, the trenched vertical semiconductor power device furtherincludes a protective passivation layer covering the verticalsemiconductor power device having metal contact openings to form metalcontacts therein to electrically contact the trenched verticalsemiconductor device. In a preferred embodiment, the inter-dielectriclayer disposed above the trenched gate having a layer thicknesssubstantially the same as the gate dielectric layer.

Referring to FIGS. 9A to 9T a serial of side cross sectional views forillustrating the processing steps to manufacture the MOSFET device asthat shown in FIG. 7. In FIG. 9A, an initial oxidation is performed on asubstrate 205 to form an initial oxide layer 208 followed by applying atrench mask 209. In FIG. 9B, the initial oxide layer 208 is etched andthe photo resist layer 209 is stripped. In FIG. 9C, a trench etch iscarried out to open a plurality of trenches into the substrate 205. InFIG. 9D, a gate oxidation process is performed to grow a gate oxidelayer 215 and in FIG. 9E, a polysilicon layer 220 is deposited into thetrenches followed by a blanket polysilicon etch back to form thetrenched gate 220 as shown in FIG. 9F. In FIG. 9G, the initial oxidelayer 208 is removed, followed by growing a screen oxide layer 218 asshown in FIG. 9H. In FIG. 9I, a body mask 219 is applied to carry out abody implant to form the body regions 225, then in FIG. 9J, the bodymask 219 is removed and a body diffusion is carried out to diffuse thebody regions 225 into the substrate 205. In FIG. 9K, a source mask 228is applied followed by a source implant to form a plurality of sourceregion 230, followed by removing the source mask 228 and a sourcediffusion to diffuse the source regions 230 into the substrate 205 asshown in FIG. 9L. In FIG. 9M, a bottom oxide layer 208′ of an ONO(oxide-nitride-oxide) is first processed followed deposition of apolysilicon layer 235 in FIG. 9N, then the polysilicon layer mask isapplied (not shown) to pattern the polysilicon layer 235 intogate-overlying polysilicon segments 235 as shown in FIG. 9O. In FIG. 9P,a LTO layer 240 and a BPSG layer 245 are deposited on top of the devicefollowed by a BPSG densification process shown in FIG. 9Q. In FIG. 9R, acontact mask (not shown) is applied to open a plurality of contactopening 255 followed by carrying out a contact implant and LTO/BPSGreflow as shown in FIG. 9S. In FIG. 9T, a metal layer 250 is depositedon top followed by applying a metal mask to carry out a metal layer etchto pattern the metal contacts 250.

This invention further discloses a buck converter that includes ahigh-side MOSFET device having a first high-side source connected to alow-side drain of a low-side MOSFET device. The buck inverter furtherincludes a capacitor formed between a conductive layer covering over aninter-dielectric layer disposed on top of a trenched gate of thelow-side MOSFET device for increasing a gate-source capacitance Cgs fordrawing a large current to the ground thus preventing a shoot through.In a preferred embodiment, the trenched gate of the low side MOSFETdevice further includes a trenched polysilicon gate. In a preferredembodiment, the conductive layer further includes a second polysiliconlayer covering an inter-poly dielectric layer disposed on top of atrenched polysilicon gate of the low side MOSFET device. In a preferredembodiment, the conductive layer further connecting to a source of thelow side MOSFET device. In a preferred embodiment, the inter-dielectriclayer disposed above the trenched gate having a layer thickness rangingsubstantially the same as a gate dielectric thickness of the low sideMOSFET device. In a preferred embodiment, the trenched gate of the lowside MOSFET device further includes a gate protrusion protruding outsideof the trenched gate. In a preferred embodiment, the low side MOSFETdevice further includes a trenched N-channel metal oxide semiconductorfield effect transistor (MOSFET) power device. In a preferredembodiment, the low side MOSFET device further includes a trenchedP-channel metal oxide semiconductor field effect transistor (MOSFET)power device.

Although the present invention has been described in terms of thepresently preferred embodiment, it is to be understood that suchdisclosure is not to be interpreted as limiting. Various alterations andmodifications will no doubt become apparent to those skilled in the artafter reading the above disclosure. Accordingly, it is intended that theappended claims be interpreted as covering all alterations andmodifications as fall within the true spirit and scope of the invention.

1. A trenched vertical semiconductor power device comprising: acapacitor formed between a conductive layer covering over aninter-dielectric layer disposed on top of a trenched gate.
 2. Thetrenched vertical semiconductor power device of claim 1 furthercomprising: a trenched metal oxide semiconductor field effect transistor(MOSFET) power device.
 3. The trenched vertical semiconductor powerdevice of claim 1 wherein: said trenched gate further comprising atrenched polysilicon gate.
 4. The trenched vertical semiconductor powerdevice of claim 1 wherein: said conductive layer further comprising asecond polysilicon layer covering an inter-poly dielectric layerdisposed on top of a trenched polysilicon gate.
 5. The trenched verticalsemiconductor power device of claim 1 wherein: said conductive layerfurther connecting to a source of said vertical power device.
 6. Thetrenched vertical semiconductor power device of claim 1 furthercomprising: a protective passivation layer covering said verticalsemiconductor power device having metal contact openings to form metalcontacts therein to electrically contact said trenched verticalsemiconductor device.
 7. The trenched vertical semiconductor powerdevice of claim 1 wherein: said inter-dielectric layer disposed abovesaid trenched gate having a layer thickness ranging substantially thesame as a gate dielectric thickness.
 8. The trenched verticalsemiconductor power device of claim 1 wherein: said trenched gatefurther includes a gate protrusion protruding outside of said trenchedgate.
 9. The trenched vertical semiconductor power device of claim 1further comprising: a trenched N-channel metal oxide semiconductor fieldeffect transistor (MOSFET) power device.
 10. The trenched verticalsemiconductor power device of claim 1 further comprising: a trenchedP-channel metal oxide semiconductor field effect transistor (MOSFET)power device.
 11. A buck converter comprising: a high-side MOSFET devicehaving a first high-side source connected to a low-side drain of alow-side MOSFET device; and a capacitor formed between a conductivelayer covering over an inter-dielectric layer disposed on top of atrenched gate of said low-side MOSFET device for increasing agate-source capacitance Cgs for drawing a large current to the groundthus preventing a shoot through.
 12. The buck converter of claim 11wherein: said trenched gate of said low side MOSFET device furthercomprising a trenched polysilicon gate.
 13. The buck converter of claim11 wherein: said conductive layer further comprising a secondpolysilicon layer covering an inter-poly dielectric layer disposed ontop of a trenched polysilicon gate of said low side MOSFET device. 14.The buck converter of claim 11 wherein: said conductive layer furtherconnecting to a source of said low side MOSFET device.
 15. The buckconverter of claim 11 wherein: said inter-dielectric layer disposedabove said trenched gate having a layer thickness ranging substantiallythe same as a gate dielectric thickness of said low side MOSFET device.16. The buck converter of claim 11 wherein: said trenched gate of saidlow side MOSFET device further includes a gate protrusion protrudingoutside of said trenched gate.
 17. The buck converter of claim 11wherein: said low side MOSFET device further comprising a trenchedN-channel metal oxide semiconductor field effect transistor (MOSFET)power device.
 18. The buck converter of claim 11 wherein: said low sideMOSFET device further comprising a trenched P-channel metal oxidesemiconductor field effect transistor (MOSFET) power device.
 19. Amethod for fabricating a trenched vertical semiconductor power devicecomprising: forming a capacitor between a conductive layer covering overan inter-dielectric layer disposed on top of a trenched gate.
 20. Themethod of claim 19 further comprising: forming said trenched gate as atrenched polysilicon gate.
 21. The method of claim 19 wherein: said stepof covering said conductive layer over said inter-dielectric layerfurther comprising forming a second polysilicon layer covering aninter-poly dielectric layer disposed on top of a trenched polysilicongate.
 22. The method of claim 19 further comprising: electricallyconnecting said conductive layer to a source of said verticalsemiconductor power device.
 23. The method of claim 19 furthercomprising: forming a protective passivation layer covering saidvertical semiconductor power device and selectively etching metalcontact openings to form metal contacts therein to electrically contactsaid trenched vertical semiconductor device.
 24. The method of claim 19wherein: said step of forming said inter-dielectric layer disposed abovesaid trenched gate further comprising a step of forming saidinter-dielectric layer with a layer thickness substantially the same asa gate dielectric thickness.
 25. The method of claim 19 furthercomprising: forming said trenched gate with a gate protrusion protrudingoutside of said trenched gate.
 26. The method of claim 19 furthercomprising: forming said vertical semiconductor device as a trenchedN-channel metal oxide semiconductor field effect transistor (MOSFET)power device.
 27. The method of claim 19 further comprising: formingsaid vertical semiconductor device as a trenched P-channel metal oxidesemiconductor field effect transistor (MOSFET) power device.
 28. Amethod for adjusting a gate-source capacitance (Cgs) of a trenchedMOSFET device comprising: disposing a capacitor on top of a trenchedgate by forming a conductive layer covering over an inter-dielectriclayer deposited on top of said trenched gate of said MOSFET device. 29.The method of claim 28 further comprising: forming said trenched gate asa trenched polysilicon gate.
 30. The method of claim 29 wherein: saidstep of covering said conductive layer over said inter-dielectric layerfurther comprising a step of forming a second polysilicon layer coveringan inter-poly dielectric layer disposed on top of said trenchedpolysilicon gate.
 31. The method of claim 28 further comprising: formingsaid trenched gate with a gate protrusion protruding outside of saidtrenched gate.